Product

3D AOI

Unleash the Power of Al: High-Speed, High-Coverage 3D AOI for Unmatched Quality Control.

Product Categories > AOI

High Coverage Rate

Equipped with vertical and side-view cameras, it captures defects from all angles

High Efficiency

NVIDIA CUDA combined with the FLYTake intelligent scheduling engine, with a speed as fast as 0.27 seconds per Field of View (FOV)

High-precision 3D Measurement

The newly designed DLP projector features high resolution and high contrast, with real-time adjustable phase steps and brightness

AI

AI is everywhere, AI programming, AI detection, AI re-judgment

Auto-focus on the Z-axis

Track the height of components at different levels, accurately identify defects such as polarity and wrong part

High Reliability

Integrated casting platform with full closed-loop motion control, equipped with a 100nm linear scale

Warpage Measurement

Analyze the corresponding data through component and PCB warpage measurement to improve manufacturing processes.

Laboratory-level BGA Flatness measurement.

Laboratory-level BGA flatness measurement.

Position Measurement

Laboratory-level positional tolerance measurement technology.

3D Extra component, Foreign Object Detection

Measure the extra component and foreign object by 3D whole board measurement , excluding interference from factors such as PCB color and brightness.

IPC-A-610 Inspection Standard

Set IPC-A-610 inspection with one click, quantify inspection standards.

Industry 4.0

IPC-Hermes+IPC-CFX
True color restoration makes the image colors closer to the actual PCBA. Whole board height measurement truly and directly reveals the defects of components.
High-precision DLP projection, multi-angle and multi-phase measurement system, accurately restores the real height of components, and measures defects such as component lifting and lead lifting.
The leading image restoration technology, combined with Deep OCR text recognition, accurately identifies defects such as wrong part. The automatic height focusing technology (with a range of 40mm) solves the body inspection of components with various heights.
Defocus image restoration technology
Highly automatic focus
Laboratory-level warpage measurement.
Laboratory-level flatness measurement.
Device type
FA-OWL-H
FA-OWL-LH
FA-OWL-D
Transfer Lane
Standard size
Large size
Dual lane
PCB Size
50 x 50 – 510 x 500 mm
50 x 50 – 870 x 686 mm
Single lane:50 x 50 – 510 x 500 mm Dual lane:50 x 50 – 510 x 320 mm
PCB Thickness
0.5 - 7 mm
Maximum PCB Weight
12 kg
Imaging Resolution
6.6μm,12μm
Height Resolution
1μm
Dimensions
1040 W x 1450 D x 1550 H mm
1340 W x 1450 D x 1550 H mm
1040 W x 1450 D x 1550 H mm
Weight
1220kg
1230kg
1230kg
Device type
FA-OWL-H
Transfer Lane
Standard size
PCB Size
50 x 50 – 510 x 500 mm
PCB Thickness
0.5 - 7 mm
Maximum PCB Weight
12 kg
Imaging Resolution
6.6μm,12μm
Height Resolution
1μm
Dimensions
1040 W x 1450 D x 1550 H mm
Weight
1220kg
Device type
FA-OWL-LH
Transfer Lane
Large size
PCB Size
50 x 50 – 870 x 686 mm
PCB Thickness
0.5 - 7 mm
Maximum PCB Weight
12 kg
Imaging Resolution
6.6μm,12μm
Height Resolution
1μm
Dimensions
1340 W x 1450 D x 1550 H mm
Weight
1230kg
Device type
FA-OWL-H
Transfer Lane
Dual lane
PCB Size
Single lane:50 x 50 – 510 x 500 mm Dual lane:50 x 50 – 510 x 320 mm
PCB Thickness
0.5 - 7 mm
Maximum PCB Weight
12 kg
Imaging Resolution
6.6μm,12μm
Height Resolution
1μm
Dimensions
1040 W x 1450 D x 1550 H mm
Weight
1230kg
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